Glossary of Terms Power Inductor

Glossary of Terms:

AC Current:
AC current flowing through inductor

Bracket:
Method of attaching unit to panel chassis which does not provide any electrical connections.

Core Geometry:
Style or type of core structure. Core geometries have been developed for use in different circuit applications.

DC Current:
DC current flowing through inductor

DC Resistance:
Maximum wire resistance of the inductor

EI Laminations:
A core structure that is made of usually silicon steel metal pieces shaped like “E’s” and “I’s”.

Ferrite E Core:
An “E” shape structure made from dense, homogeneous ceramic materials made by mixing iron oxide with oxides or carbonates of one or more metals such as manganese, zinc, or magnesium. An E-core transformer requires two core pieces per transformer.

Ferrite Toroid:
A doughnut shape structure made from dense, homogeneous ceramic materials made by mixing iron oxide with oxides or carbonates of one or more metals such as manganese, zinc, or magnesium.

Full Load Inductance:
Inductance under full load conditions

Frequency Range:
Range of frequencies over which the inductor is expected operate

Hipot:
Maximum isolation voltage from winding to winding or winding to core / ground.

Hipot Duration:
Length of time in seconds to test device at the hipot voltage.

Mounting:
The method used to mount the component to the circuit board.

No Load Inductance:
Inductance value under no load conditions expressed in micro henries.

Operating Frequency:
Frequency at which inductor will operate

Operating Temperature:
The operating temperature is the anticipated maximum temperature the transformer is expected to operate expressed in degrees Celsius.

Powder Core Toroid:
A doughnut shaped structure designed to have distributed air gaps within its shape made from ferrous alloy powder which result in low losses.

SMT Mounting:
Components manufactured with solder feet that are soldered to pads on the circuit board providing the mounting and connection to the circuit. Electrical connection is made through soldering the component to these solder pads.

Thru Hole Mounting:
Component is manufactured with pins that mount the device through holes in the circuit board which are soldered.

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